Biography
1998.05 Rensselaer Polytechnic Institute, Materials Science and Engineering (Ph.D.)
1993.05 Massachusetts Institute of Technology, Materials Science and Engineering (M.S.)
1991.12 Rensselaer Polytechnic Institute, Materials Science and Engineering (B.S.)
Careers
2007 – Present Seoul National Univ. of Science and Technology (Professor)
2021 – 2023 Advanced Semiconductor Center at Seoul Tech (Director)
2020 – Present ELOHIM Inc. (Ressearch Director)
2021 – 2023 National Research Foundation of Korea (Review Board)
2021 – 2023 Intellectual Property Trial and Appeal Board (Technical advisor)
2018 – 2020 Technical Consultant at TSE
2014 – 2015 Technical Consultant at SK Hynix
2005 – 2007 Korea Institute of Science and Technology (Sr. Scientist)
1998 – 2005 Intel (Engineering Manager)
1994 – 1994 Samsung Electronics (Engineer)
Research Areas
Advanced Semiconductor packaging
Semiconductor Processing
Electronic Materials
Journal Papers
◾ Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bonding, applied sciences, No.14 pp.14701~14711, 2024김사라은경
Conference Papers
◾ So-Yeon Park, Cha-Hee Kim, Gwang-Sik Oh, Young Su Yun, Jiho Kang, Sarah Eunkyung Kim, and Won-Jun Lee, Effect of Cu pad geometry and dishing in Cu/SiCN hybrid bonding process: A finite element analysis study, 24th ECS program (on-line), Gothenburg, Sweden, 2023김사라은경
Awarded
◾ Potential use of fly cutting method for Cu/polymer planarization in hybrid bonding, 현장우수포스터상, 한국반도체학술대회, 2024김사라은경
◾ Quantitative interfacial adhesion energy measurement of Cu-Cu and SiO2-SiO2 bonding interface for hybrid bonding applications, Best Paper Award, International Symposium on Microelectronics and Packaging, 2023김사라은경
◾ 하이브리드 본딩을 위한 SiO2의 Ar/N2 2단계 플라즈마 전처리, 우수 포스터 발표상, 한국 마이크로전자 및 패키징 학술대회 (KMEPS), 2023김사라은경
