학력
1998.05 Rensselaer Polytechnic Institute, Materials Science and Engineering (Ph.D.)
1993.05 Massachusetts Institute of Technology, Materials Science and Engineering (M.S.)
1991.12 Rensselaer Polytechnic Institute, Materials Science and Engineering (B.S.)
주요 경력
2007 – Present Seoul National Univ. of Science and Technology (Professor)
2022 – 2024 Advanced Semiconductor Center at Seoul Tech (Director)
2020 – Present ELOHIM Inc. (Ressearch Director)
2021 – 2023 National Research Foundation of Korea (Review Board)
2021 – 2023 Intellectual Property Trial and Appeal Board (Technical advisor)
2018 – 2020 Technical Consultant at TSE
2014 – 2015 Technical Consultant at SK Hynix
2005 – 2007 Korea Institute of Science and Technology (Sr. Scientist)
1998 – 2005 Intel (Engineering Manager)
1994 – 1994 Samsung Electronics (Engineer)
연구 분야
Advanced Semiconductor Packaging
Semiconductor Processing
Electronic Materials
저널 논문
◾ Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bonding, applied sciences, No.14 pp.14701~14711, 2024김사라은경
학술대회
◾ 정광휘, 권윤후, 김서영, 황찬우, 김사라은경, 웨이퍼 레벨 3D 적층 메모리 제조의 수율 효율성에 관한 연구, 한국반도체학술대회, 경주화백컨벤션센터, 2024김사라은경
◾ 임동현, 김민재, 권범성, 김혜교, 안종현, 김사라은경, 구리/옥사이드 하이브리드 본딩 전 다양한 플라즈마 영향 연구, 한국반도체학술대회, 경주화백컨벤션센터, 2024김사라은경
◾ So-Yeon Park, Cha-Hee Kim, Gwang-Sik Oh, Young Su Yun, Jiho Kang, Sarah Eunkyung Kim, and Won-Jun Lee, Effect of Cu pad geometry and dishing in Cu/SiCN hybrid bonding process: A finite element analysis study, 24th ECS program (on-line), Gothenburg, Sweden, 2023김사라은경
수상
◾ Potential use of fly cutting method for Cu/polymer planarization in hybrid bonding, 현장우수포스터상, 한국반도체학술대회, 2024김사라은경
◾ Quantitative interfacial adhesion energy measurement of Cu-Cu and SiO2-SiO2 bonding interface for hybrid bonding applications, Best Paper Award, International Symposium on Microelectronics and Packaging, 2023김사라은경
◾ 하이브리드 본딩을 위한 SiO2의 Ar/N2 2단계 플라즈마 전처리, 우수 포스터 발표상, 한국 마이크로전자 및 패키징 학술대회 (KMEPS), 2023김사라은경
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